Basic Info.
Packaging & Delivery
To be negotiated ( > 20 Pieces)
Product Description
Innovative PCBs for Advanced Electronics
Finest Printed Circuit Board Limited specializes in high-quality PCB and PCBA manufacturing, offering tailored solutions for diverse applications. Our product lineup includes camera boards, lithium battery chargers, and HDI flex PCBs, all crafted to meet stringent performance and reliability standards.
Precision Camera Board PCBs
Our camera board PCBs are designed for:
- Enhanced Imaging Performance: Optimized to support high-resolution sensors and complex imaging algorithms, ensuring crisp and clear image capture.
- Compact Integration: Ideal for space-constrained camera systems, providing robust performance without compromising on size.
- High-Speed Processing: Equipped to handle rapid data processing and transfer, essential for real-time imaging applications.
Customized Lithium Battery Charger PCBs
Our lithium battery charger PCBs offer:
- Efficient Charging Solutions: Designed to manage the charging process for lithium batteries with high efficiency and safety.
- Thermal Management: Engineered with advanced thermal control features to prevent overheating and ensure reliable operation.
- Flexible Configurations: Customizable to fit a variety of battery sizes and specifications, catering to different charging needs.
Advanced China Mouse PCBs
Our China mouse PCBs feature:
- Precision Tracking: Engineered for accurate tracking and response, enhancing user control and interaction.
- Durable Design: Built to withstand frequent use and provide consistent performance in diverse computing environments.
- Customizable Features: Tailored to meet specific requirements, including ergonomic designs and additional functionalities.
High-Density Interconnect (HDI) Flex PCBs
Our HDI flex PCBs are characterized by:
- High Flexibility: Ideal for applications requiring flexible circuit designs, allowing for complex and compact configurations.
- High-Density Layouts: Enables more components and connections in a smaller space, improving performance and integration.
- Superior Performance: Ensures high-speed signal transmission and reliability in demanding applications.
Microwave and RF PCBs
Our microwave and RF PCBs are designed for:
- High-Frequency Performance: Engineered to handle high-frequency signals with minimal loss and interference, crucial for microwave and RF applications.
- Robust Construction: Built to meet the demands of high-power and high-frequency operations, ensuring durability and reliability.
- Custom Design: Tailored to specific frequency ranges and performance requirements, providing optimal results for advanced RF applications.
Why Choose Our Solutions?
- Custom Tailoring: Each PCB is designed to meet the specific needs of your application, ensuring precise and reliable performance.
- High Standards: Adheres to rigorous quality standards for durability, efficiency, and operational excellence.
- Expert Support: Our experienced team is dedicated to providing comprehensive support and solutions tailored to your project needs.
Contact us today to discuss your requirements and receive a tailored quote for our advanced PCB solutions. We are committed to delivering exceptional quality and performance to enhance your electronic products.
PCBA Technical Capability | |
1. Assembly Type:: | FR4, FPC, Rigid-flex PCB, Metal base PCB. |
2. Assembly Specification: | Min size L50*W50mm; Max size: L510*460mm |
3. Assembly thickness: | Min thickness: 0.2mm; Max thickness: 3.0mm |
4. Components Specification | |
Components DIP: | 01005Chip/0.35 Pich BGA |
Minimum device accuracy: | +/-0.04mm |
Minimum footprint distance: | 0.3mm |
5. File format: | BOM list; PCB Gerber file: |
6. Test | |
IQC: | Incoming inspection |
IPQC: | Production inspection; first ICR test |
Visual QC: | Regularly quality inspection |
SPI test : | Automatic solder paste optical inspection |
AOI: | SMD component welding detection, components shortage & component polarity detection |
X-Ravd: | BGA test; QFN and other precision devices hidden PAD device inspection |
Function test: | Test function and performance according to the customer's test procedures and steps |
7. Reworking: | BGA rework equipment |
8. Delivery Time | |
Normal delivery time: | 24 hours( fastest 12 hours quick-turn) |
Small production: | 72 hours( fastest 24 hours quick-turn) |
Medium production: | 5 working days. |
9. Capacity: | SMT assembly 5 million points/day; plug-in & welding 300,000 points/day; 50-100 items/day |
10. Components Service | |
A full set of substitute materials: | Have experience in component procurement sourcing, and management systems, and provide cost-effective services for OEM projects |
Only SMT: | Do SMT and backhand welding according to components PCB boards provided by customers. |
Components purchasing: | Customers provide core components, and we provide component sourcing services. |
PCB Specification: | |||||
PCB layers: | 1-24layers | ||||
PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | ||||
PCB max. board size: | 620*1100mm (Custom) | ||||
PCB certificate: | RoHS Directive-Compliant | ||||
PCB Thickness: | 1.6 ±0.1mm | ||||
Layer Copper Thickness: | 0.5-5oz | ||||
Inner Layer Copper Thickness: | 0.5-4oz | ||||
PCB max. board thickness: | 6.0mm | ||||
Minimum Hole Size: | 0.20mm | ||||
Minimum Line Width/Space: | 3/3mil | ||||
Min. S/M Pitch: | 0.1mm(4mil) | ||||
Plate Thickness and Aperture Ratio : | 30:1 | ||||
Minimum Hole Copper: | 20µm | ||||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | ||||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | ||||
Hole Position Deviation: | ±0.05mm (2mil) | ||||
Outline Tolerance: | ±0.05mm (2mil) | ||||
PCB solder mask: | Black, white, yellow | ||||
PCB surface finished: | HASL Lead-free, Immersion ENIG, Chem Tin, Flash Gold, OSP, Gold finger, Peelable, Immersion Silver | ||||
Legend: | White | ||||
E-test: | 100% AOI, X-ray, Flying probe test. | ||||
Outline: | Rout and Score/V-cut | ||||
Inspection Standard: | IPC-A-610CCLASSII | ||||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | ||||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section, and More |